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| Conference Web Home | Conference Program Table | ||
| Welcome
to the 11th International CDIO Conference at Chengdu University of Information Technology Chengdu, China June 7-11, 2015 The Proceedings of the Conference are available to participants on a USB key and most contributions will soon be indexed on the CDIO Web Site. On the USB you will find a tabular program list with links to the papers. For any late-breaking news, check the conference home page. |
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Message from the
Chairpersons
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| On behalf of the
Conference Organizing Committee, we are delighted to
welcome you to the 11th International CDIO Conference in
the city of Chengdu. “The CDIO Initiative” is an innovative educational framework for producing the next generation of engineers. Founded by the Massachusetts Institute of Technology and three Swedish universities in 2000, the CDIO Initiative has since expanded to various regions around the world. More than 100 leading universities and other types of higher education institutions have joined the Initiative. Since 2005, the CDIO Initiative has gradually been introduced into China and has attracted numerous universities and institutes throughout China to promote the reform of engineering education. This year, the annual conference will be hosted by Chengdu University of Information Technology and Shantou University. The theme of conference this year is “Collaboration and Extension”. It is expected that the conference will provide a platform for universities and colleges, scientific research institutions, and enterprises to exchange information and review development through a variety of forms, such as keynote speeches, workshops, poster sessions and project exhibition. During the conference, we will organize a CDIO Academy for international students and a tour around Chengdu to enrich the event and make the experience more enjoyable. We hope that the conference will provide participants with a great experience of learning, networking and inspiration. We would like to thank all authors for their excellent contributions, the program committee for their competent evaluation of the large number of submissions, and the keynote speakers for sharing their expertise. In particular, we would like to thank all the attendees whose contributions and participation are essential to creating a stimulating environment at the conference. We hope that you will find the conference productive, informative, and enjoyable. As Confucius once said, “how delightful it is to have friends coming from afar”. We are warm-heartedly extending our welcome to you and are very glad to see you in Chengdu! |
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Review CommitteeWe would like to extend our profound thanks to the members of the review committee whose work and input substantially improved the quality of papers appearing at the conference.
Conference Planning CommitteeJiliu Zhou, (Conference Co-Chair), Chengdu University of Information Technology, ChinaJianxin He, (Conference Co-Chair), Chengdu University of Information Technology, China Peihua Gu, (Conference Co-Chair), Shantou University, China Xiaohua Lu, (Conference Co-Chair), Shantou University, China Xi Wu, (Conference Operations Chair), Chengdu University of Information Technology, China Rick Sellens (Technical Program Chair), Queens University at Kingston, Canada Ramon Bragos (CDIO 2014 Chair), Universitat Politecnica de Catalunya, Spain Juha Kontio (CDIO 2016 Chair), Turku University of Applied Sciences, Finland |
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2015 Conference Secretariat Chengdu University of Information Technology Email: cdio2015@cuit.edu.cn cdio2015@163.com |
Future Conferences June 12-16, 2016 12th Annual International CDIO Conference 2016 Turku University of Applied Sciences, Turku, Finland Call for Papers June 2017 13th Annual International CDIO Conference 2017 University of Calgary, Calgary, Alberta, Canada |
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| The original Call for Papers asked you to submit a 500 word plain text abstract to START and use this Paper Template for Final Submissions. These Conference Policies were followed to develop the program. | |||
| These
proceedings are registered as: ISBN |
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